Analysis and Solutions for Switching Noise Coupling in by Xavier Aragonès, José Luis González, Antonio Rubio (auth.)

By Xavier Aragonès, José Luis González, Antonio Rubio (auth.)

Modern microelectronic layout is characterised through the mixing of complete structures on a unmarried die. those structures frequently contain huge excessive functionality electronic circuitry, excessive solution analog components, excessive riding I/O, and perhaps RF sections. Designers of such structures are continuously confronted with the problem to accomplish compatibility in electric features of each part: a few circuitry offers speedy transients and massive intake spikes, while others require quiet environments to accomplish resolutions way past millivolts. Coupling among these sections is generally unavoidable, because the whole approach stocks a similar silicon substrate bulk and an analogous package deal. realizing the way in which coupling is produced, and realizing ways to isolate coupled circuitry, and the way to use each strategy, is then essential wisdom for each IC fashion designer.
Analysis and ideas for Switching Noise Coupling in Mixed-SignalICs is an in-depth examine coupling during the universal silicon substrate, and noise on the energy offer strains. It explains the effortless wisdom had to comprehend those phenomena and provides a assessment of earlier works and new examine effects. the purpose is to supply an realizing of the explanations for those specific methods of coupling, assessment and recommend ideas to noise coupling, and supply standards to use noise aid.
Analysis and recommendations for Switching Noise Coupling in Mixed-SignalICs is a perfect publication, either as introductory fabric to noise-coupling difficulties in mixed-signal ICs, and for extra complex designers dealing with this problem.

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Eklund, R. Arvidson, "A Multiple Sampling, Single AlD Conversion Teehnique for I1Q Demodulation in CMOS", IEEE J. Solid-State Circuits, vol. 31, no. 12, pp. 1987-1994, December 1996. K. Verghese, DJ. Allstot, S. Masui. "Rapid Simulation of Substrate Coupling Effects in MixedMode ICs", Proc. erence, pp. 4, 1993. [26] T. Gabara, "Reduced Ground Bounce and Improved Lalch-up Suppression through Substrate Conduction", IEEE J. Solid-State Circuits, vol. 23, no. 5, pp. 1224-1232, October 1988. 3 Substrate coupling modeling This chapter reviews the different methods put forward in the literature for modeling the substrate.

B) Detail of one of the test circuits. structures have two N-wells, one for the noisy PMOS and the other for the sensor circuit, cross-placed as on a chess board. b. 17 shows the characteristic transfer curves of both sensing circuits. b, due to the lower PMOS transconductance. 3 V ~~ ,,:iS~g·.. 16 Test circuit implemented. a) NMOS acting as a sensor. b) PMOS acting as a sensor. Three measurements are made on every test structure: one biasing the sensing device with a 0 V gate yoltage, another with a 3 V biasing, and a third one driving the sensor to its maximum gain point.

1989. [2] SimultanecJUs Switching Noise ofCMDS Devices and Systems, R. L. Prince, Kluwer Academic Publishers, 1994. [3] A. Pun, T. Yeung, J. Lau, ER. Clement, D. Su, "Experimental Results and Simulation of Substrate Noise Coupling via Planar Spirallnductor in RF IC's", Proc. IEEE Int. Electron Devices Meeting, 1997. [4] T. Yeung, A. Pun, Z. Chen, J. R. Clement, "Noise Coupling in Heavily and Lightly Doped Substrate from Planar Spiral Inductor", Proc. IEEE International Symposium on Circuits and Systems, pp.

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